ACCELERATE • CREATE • CONNECT

Engineering Hardware from Concept to Industrial Scale

AXCORETRONICS specializes in high-speed multi-layer PCB design, industrial automation, rapid POC turnaround, embedded firmware RnD, custom mechanical enclosures, and academic capstone engineering kits.

48h Fast-Track POC
IPC-Class Multi-layer PCB
100% Client NDA Protection
99.8%
First-Pass PCB Yield
AXCORETRONICS Hardware Engineering Bench
AXCORE Hardware Prototype Lab
Live Telemetry & Multi-Layer Circuit Bring-Up
500+
Prototypes Delivered
500+
Hardware POCs & Systems Built
48h
Rapid Prototype Turnaround
16+
Max PCB Layers Supported
100%
Source Files & IP Handover

Comprehensive Hardware & Automation Solutions

From initial concept schematics to industrial mass manufacturing and student capstone excellence, explore our full suite of technical services.

Industrial Automation Systems INDUSTRIAL

Industrial Automation

Custom PLC/SCADA programming, sensor telemetry arrays, automated test fixtures (ATE), motor drive integration, and machine retrofitting.

  • Siemens, Schneider & Allen-Bradley PLC
  • Modbus, OPC-UA & MQTT Industrial IoT
  • Automated Quality Inspection Jigs
High Speed PCB Design ELECTRONICS

PCB Design & Layout

High-density interconnect (HDI), multi-layer high-speed layout, impedance control, RF microstrip, thermal dissipation, and DFM/DFA review.

  • 2 to 16+ Layer Rigid, Flex & Rigid-Flex
  • Length Matching & High-Speed Differential
  • Full Gerbers, Pick & Place + BOM Sourcing
POC Execution Workbench PROTOTYPING

POC Execution Support

Fast-track proof-of-concept hardware bring-up for startups, inventors, and enterprise teams seeking working functional demonstration units.

  • 48h to 7-Day Rapid Turnaround
  • Sensor-to-Cloud Integration
  • Investor Demo Ready Packaging
Embedded Firmware RnD R&D & FIRMWARE

RnD & Firmware Support

Low-level firmware development, FreeRTOS architectures, power profiling, reverse engineering, and custom driver development for ARM, ESP32 & STM32.

  • FreeRTOS, Zephyr OS & Embedded C/C++
  • BLE, LoRaWAN, CAN Bus, Wi-Fi 6
  • Ultra-Low Power Battery Optimization
College Capstone Engineering Projects ACADEMIC

College Projects & Capstone

End-to-end B.Tech / M.Tech final year project guidance, IEEE base paper implementations, custom robotics kits, complete documentation, and viva prep.

  • Ready Tested Working Hardware Kits
  • IEEE Paper Synopsis & Thesis Report
  • Step-by-Step Viva & Code Mentorship
Custom Electronics Enclosures MECHANICAL

Custom Enclosures & CAD

Tailor-made mechanical housings, IP65/IP67 rated waterproof enclosures, DIN-rail snap modules, and heat-sink thermal management enclosures.

  • SolidWorks & Fusion 360 PCB Mating
  • IP65 / IP67 Silicone Gasket Sealing
  • Anodized Aluminium & ABS/Polymer
3D and Metal 3D Print Service RAPID PROTOTYPE

3D & Metal 3D Print Service

Complementary rapid additive manufacturing service for sensor brackets, custom mounts, precision SLA resin housings, and DMLS direct metal 3D printing.

  • High-Resolution SLA Resin & PETG/ABS
  • DMLS Metal 3D: Stainless Steel & Titanium
  • Brass Threaded Inserts & Post-Finishing

Ultra-Precision PCB Engineering Stack

We design PCBs that satisfy stringent EMI/EMC compliance, optimal thermal distribution, and seamless fabrication parameters for high-density modern electronics.

0.1 mm / 4 mil
Min Trace Width & Spacing
16+ Layers
Blind & Buried Microvias
±5% Ohms
Controlled Impedance Tolerance
IPC-A-610
Class 2 & Class 3 Assembly
Interactive PCB Layer Preview

Instant Project Scope & Timeline Estimator

Configure your technical parameters to estimate project delivery milestones, and directly transfer the generated spec to our engineering quote desk.

AXCORE SPECIFICATION RECAP

Estimated Scope

Service: PCB Design & Hardware
Tier: Multi-layer / IoT
Priority: Standard Delivery
Add-ons: Firmware/RTOS
Target Delivery Window
5 - 7 Business Days

College Project Innovation Catalog

Pre-engineered, fully-tested final year capstone project kits with complete IEEE documentation, source codes, circuit diagrams, and viva mentorship.

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The AXCORE Execution Framework

A battle-tested 5-phase engineering protocol ensuring zero design ambiguities, high hardware yields, and reliable deployment.

01

Requirements & Feasibility

BOM component availability check, power budgets, functional block architecture, and pinout definition.

02

Schematic & PCB Layout

High-speed routing, impedance matching, DRC rules check, and 3D CAD mechanical clash detection.

03

Rapid Prototyping

SMT component mounting, visual inspection, power rail bring-up, and initial oscilloscope signal analysis.

04

Firmware & Enclosure

Embedded firmware flashing, custom 3D enclosure fitment, peripheral sensor validation, and stress testing.

05

Handover & Deploy

100% complete IP handover: Altium/KiCad source files, Gerbers, STEP models, firmware repository, and docs.

Let’s Bring Your Hardware to Life

Submit your project specifications, schematic notes, or academic ideas. Our lead hardware engineers respond within 24 business hours.

Official Inquiries
Engineering Direct Hotline
+91 87628 45461 / WhatsApp Ready
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Global Delivery
Worldwide Prototype Shipping

🔒 Strict Client Confidentiality & NDA

Every project schematic, BOM, and proprietary IP shared with AXCORETRONICS is protected under our mutual Non-Disclosure Agreement. You retain 100% intellectual property ownership.

Request a Project Quote (RFQ)

Fill in your specifications or load your estimate directly above.